佳 盼 塑 胶
JIA PAN SU JIAO
/ Product details
/ classification
POM S 9243 XAP LS 抗紫外线,抗撞击
HOSTAFORM S 9243 XAP² ™ LS | POM | Impact Modified
Description
POM copolymer, modified
Injection molding type, elastomer-containing; with higher impact strength and slightly lower hardness, rigidity and chemical resistance than the basic type HOSTAFORM C 9021 Reduced emission grade, Emission according to VDA 275 < 5 mg/kg good weld strength.
Burning rate according to FMVSS 302 < 100 mm/min (1 mm thickness)
Preliminary Datasheet for natural and colored grades
|
ISO Data |
Mechanical properties |
Value |
Unit |
Test Standard |
|
Phys |
Density |
1330 |
kg/m³ |
ISO 1183 |
|
Melt volume rate (MVR) |
4 |
cm³/10min |
ISO 1133 |
|
|
MVR test temperature |
190 |
℃ |
ISO 1133 |
|
|
MVR test load |
2.16 |
kg |
ISO 1133 |
|
|
Mold shrinkage - parallel |
1.9 |
% |
ISO 294-4 |
|
|
Mold shrinkage - normal |
1.8 |
% |
ISO 294-4 |
|
|
Water absorption (23℃-sat) |
1 |
% |
ISO 62 |
|
|
Mech |
Mechanical properties |
Value |
Unit |
Test Standard |
|
Tensile modulus (1mm/min) |
1950 |
MPa |
ISO 527-2/1A |
|
|
Tensile stress at yield (50mm/min) |
44 |
MPa |
ISO 527-2/1A |
|
|
Tensile strain at yield (50mm/min) |
9 |
% |
ISO 527-2/1A |
|
|
Nominal strain at break (50mm/min) |
40 |
% |
ISO 527-2/1A |
|
|
Tensile creep modulus (1h) |
1700 |
MPa |
ISO 899-1 |
|
|
Tensile creep modulus (1000h) |
950 |
MPa |
ISO 899-1 |
|
|
Flexural modulus (23℃) |
1850 |
MPa |
ISO 178 |
|
|
Charpy impact strength @ 23℃ |
NB |
kJ/m² |
ISO 179/1eU |
|
|
Charpy impact strength @ -30℃ |
200P |
kJ/m² |
ISO 179/1eU |
|
|
Charpy notched impact strength @ 23℃ |
15 |
kJ/m² |
ISO 179/1eA |
|
|
Charpy notched impact strength @ -30℃ |
9 |
kJ/m² |
ISO 179/1eA |
|
|
Therm |
Thermal properties |
Value |
Unit |
Test Standard |
|
Melting temperature (10℃/min) |
166 |
℃ |
ISO 11357-1,-2,-3 |
|
|
DTUL @ 1.8 MPa |
75 |
℃ |
ISO 75-1/-2 |
|
|
Coeff.of linear therm. expansion (parallel) |
1.2 |
E-4/℃ |
ISO 11359-2 |
|
|
Elec |
Electrical properties |
Value |
Unit |
Test Standard |
|
Relative permittivity - 100 Hz |
3.8 |
- |
IEC 60250 |
|
|
Relative permittivity - 1 MHz |
3.8 |
- |
IEC 60250 |
|
|
Dissipation factor - 100 Hz |
30 |
E-4 |
IEC 60250 |
|
|
Dissipation factor - 1 MHz |
60 |
E-4 |
IEC 60250 |
|
|
Volume resistivity |
1E11 |
Ohm*m |
IEC 60093 |
|
|
Surface resistivity |
1E13 |
Ohm |
IEC 60093 |
|
|
Comparative tracking index CTI |
600 |
- |
IEC 60112 |
|
|
SpecProd |
Test specimen production |
Value |
Unit |
Test Standard |
|
Processing conditions acc. ISO |
9988-2 |
- |
Internal |
Processing
Pre Drying
Necessary low maximum residual moisture content: 0.15%
It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose if the granul
The product can then be stored in standard conditions until processed.
Drying time (h):3 - 4
Drying temperature (℃):100 - 120
